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ON Semiconductor NCV8871 is a brand new adjustable output non-synchronous boost controller for automotive systems.
The internal voltage regulator included in this device provides charge to the gate driver. It has a quiescent current of 3.0 microamperes (µA) in sleep mode to minimize power consumption. It also has synchronous switching frequency characteristics, and provides two versions that can be set to a typical value of 170 kHz or a typical value of 1 MHz. Peak current mode control and internal slope compensation ensure that the device operates stably over a wide range of automotive battery voltages, and by turning off the power switch for the remainder of the switching cycle when the current limit is exceeded, to ensure that the device is in current fault conditions Under protection. The device also provides more protection with a thermal shutdown mechanism (temperature threshold of 170? C) and 3.1 V undervoltage lockout.
NCV8871 can be flexibly programmed and can provide other different frequencies for selection according to requirements. More other options include different slope compensation values, current limit setpoints, and different gate drive voltages for multiple MOSFETs. The device also supports a variety of topology configurations, including boost, flyback, single-ended primary inductance converter (SEPIC), and multiphase. The output power in the boost topology ranges from a few watts (W) to a maximum of 200 W.
The operating voltage of NCV8871 is as low as 3.2 V, and the minimum operating voltage of other controller solutions on the market is usually only 4 V, which makes this device stand out and is very suitable for engine start / stop applications. Its high integration also brings other advantages. Previously, the only option for engineers was to use more complex devices with more pins and a large number of external components. NCV8871 simplifies the design process, reduces the bill of materials (BOM), and shortens the design time.
The operating junction temperature range of NCV8871 is −40? C to 150? C. The device is packaged in a lead-free, RoHS-compliant SOIC-9 package.
April 01, 2024
February 27, 2023
October 21, 2024
October 21, 2024
October 21, 2024
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April 01, 2024
February 27, 2023
October 21, 2024
October 21, 2024
October 21, 2024
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